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Products > Integration-ready modules & platforms > COM-HPC Modules > conga-HPC/cTLU
1Specifications 2Part Number

Formfactor

COM-HPC

CPU

Intel® Core™ i7-1185G7E (4 x 1.8 GHz, 12 MB cache, 15W)
Intel® Core™ i5-1145G7E (4 x 1.5 GHz, 8 MB cache, 15W)
Intel® Core™ i3-1115G4E (2 x 2.2 GHz, 6 MB cache, 15W)
Intel® Celeron® 6305E (2 x 1.8 GHz, 4MB cache, 15W)
Intel® Core™ i7-1185GRE (4 x 1.8 GHz, 12 MB cache, 15W)
Intel® Core™ i5-1145GRE (4 x 1.5 GHz, 8 MB cache, 15W)
Intel® Core™ i3-1115GRE (2 x 2.2 GHz, 6 MB cache, 15W)

DRAM

Up to 2 SO-DIMM sockets for DDR4 memory modules up to 32 GByte each (64 GByte total) with 3200 MT/s

Ethernet

2 x 2,5 GbE with TSN support via Intel® i226 Ethernet controller series

I/O Interfaces

4 x PCIe Gen4
8 x PCIe Gen3
2 x USB 4.0
2 x USB 3.2
6 x SATA III (6Gb/s)
2 x UART
12 x GPIOs
8 x MIPI-CSI
8 x USB 2.0
SPI

Graphics

Integrated Xe (Gen 12) graphics engine with up to 96 EU (Execution Units) | Supporting 4 independent display units (4x 4k/2x 8K) | Enhanced media (AV1/12b) with up to 2 Vdbox | Next Gen IPU6 with DPHY2.1 | DP 1.4

congatec Board Controller

Multi Stage Watchdog | non-volatile User Data Storage | Manufacturing and Board Information | Board Statistics | I²C bus (fast mode, 400 kHz, multi-master) | Power Loss Control | Hardware Health Monitoring | POST Code redirection

embedded BIOS Features

AMI Aptio® UEFI firmware
32 Mbyte serial SPI with congatec Embedded BIOS feature
OEM Logo
OEM CMOS Defaults
LCD Control
Display Auto Detection
Backlight Control
Flash Update

Security

Trusted Platform Module (TPM 2.0)

Power Management

ACPI 5.0 with battery support

Operating Systems

Microsoft® Windows 11 IoT Enterprise
Microsoft® Windows® 10
Microsoft® Windows 10 IoT Enterprise
Microsoft® Windows IoT 10 Core
Linux
Android
Yocto

Hypervisor

RTS Real-Time Hypervisor

Temperature

Commercial: Operating: 0 to +60°C | Storage: -20 to +80°C
Industrial: Operating: -40 to +85°C | Storage: -40 to +85°C

Humidity

Operating: 10 to 90% r. H. non cond. / Storage 5 to 95% r. H. non cond.

Video Interfaces

3x DDI/DP++ | 1x eDP

Size

95 x 120 mm

050600

conga-HPC/cTLU-i7-1185G7E

COM-HPC Size A module based on Intel® Core™ i7-1185G7E 4-core processor with 1.8GHz up to 4.4GHz turbo boost, 12MB cache, Intel® Iris® Xe Graphics with 96EU and dual channel DDR4 3200 MT/s memory interface (Intel Tiger Lake-UP3). Embedded temperature range 0°C to 60°C.

050601

conga-HPC/cTLU-i5-1145G7E

COM-HPC Size A module based on Intel® Core™ i5-1145G7E 4-core processor with 1.5GHz up to 4.1GHz turbo boost, 8MB cache, Intel® Iris® Xe Graphics with 80EU and dual channel DDR4 3200 MT/s memory interface (Intel Tiger Lake-UP3). Embedded temperature range 0°C to 60°C.

050602

conga-HPC/cTLU-i3-1115G4E

COM-HPC Size A module based on Intel® Core™ i3-1115G4E 2-core processor with 2.2GHz up to 3.9GHz turbo boost, 6MB cache, Intel® Graphics with 48EU and dual channel DDR4 3200 MT/s memory interface (Intel Tiger Lake-UP3). Embedded temperature range 0°C to 60°C.

050603

conga-HPC/cTLU-6305E

COM-HPC Size A module based on Intel® Celeron® 6305E 2-core processor with 1.8GHz, 4MB cache, Intel® Graphics with 48EU and dual channel DDR4 3200 MT/s memory interface (Intel Tiger Lake- UP3). Embedded temperature range 0°C to 60°C.

050610

conga-HPC/cTLU-i7-1185GRE

COM-HPC Size A module based on Intel® Core™ i7-1185GRE 4-core processor with 1.8GHz up to 4.4GHz turbo boost, 12MB cache, Intel® Iris® Xe Graphics with 96EU and dual channel DDR4 3200 MT/s memory interface (Intel Tiger Lake-UP3). Industrial temperature range -40°C to 85°C.

050611

conga-HPC/cTLU-i5-1145GRE

COM-HPC Size A module based on Intel® Core™ i5-1145GRE 4-core processor with 1.5GHz up to 4.1GHz turbo boost, 8MB cache, Intel® Iris® Xe Graphics with 80EU and dual channel DDR4 3200 MT/s memory interface (Intel Tiger Lake-UP3). Industrial temperature range -40°C to 85°C.

050612

conga-HPC/cTLU-i3-1115GRE

COM-HPC Size A module based on Intel® Core™ i3-1115GRE 2-core processor with 2.2GHz up to 3.9GHz turbo boost, 6MB cache, Intel® Graphics with 48EU and dual channel DDR4 3200 MT/s memory interface (Intel Tiger Lake-UP3). Industrial temperature range -40°C to 85°C.

050658

conga-HPC/cTLU-CSA-HP-B

Standard active cooling solution for high performance COM-HPC module conga-HPC/cTLU with integrated heatpipe, 29mm height and integrated 12V fan. All standoffs are with 2.7mm bore hole.

050659

conga-HPC/cTLU-CSA-HP-T

Standard active cooling solution for high performance COM-HPC module conga-HPC/cTLU with integrated heatpipe, 29mm height and integrated 12V fan. All standoffs are M2.5mm thread.

050660

conga-HPC/cTLU-CSP-HP-B

Standard passive cooling solution for high performance COM-HPC module conga-HPC/cTLU with integrated heatpipe, 28mm height. All standoffs are with 2.7mm bore hole.

050661

conga-HPC/cTLU-CSP-HP-T

Standard passive cooling solution for high performance COM-HPC module conga-HPC/cTLU with integrated heatpipe, 28mm height. All standoffs are with M2.5mm thread.

050662

conga-HPC/cTLU-HSP-HP-B

Standard heatspreader for high performance COM-HPC module conga-HPC/cTLU with integrated heatpipe, 13mm height. All standoffs are with 2.7mm bore hole.

050663

conga-HPC/cTLU-HSP-HP-T

Standard heatspreader for high performance COM-HPC module conga-HPC/cTLU with integrated heatpipe, 13mm height. All standoffs are with M2.5mm thread.

065600

conga-HPC/EVAL-Client

Evaluation Carrier Board for COM-HPC Client type Modules.

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