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Products > Integration-ready modules & platforms > COM-HPC Modules > conga-HPC/EVAL-Server
1Specifications

Formfactor

Extended ATX

Board Variant

Evaluation Carrier Board for COM-HPC Server Type Modules (Sizes D and E)

Internal Connectors and Features

  • 2x PCIe x16 connector
  • 2x PCIe x8 connector
  • 3x PCIe x4 connector
  • 2x dual USB 2.0 header
  • M.2 Key M 2230 / 2242 / 2260 / 2280 / 22110 8x Ethernet KR interfaces connector
  • 2x SATA
  • SATA Power
  • 2x UART DB9 from module
  • 1x UART DB9 from BMC
  • 1x UART DB9 for BMC console
  • GP SPI header
  • I2C header
  • SMB header
  • eSPI header
  • SPI socket
  • GPIO header
  • Feature header
  • 3x Fan

External Connectors

  • 4x USB3.2 Gen 1 Type A
  • DP through BMC
  • 10GbE RJ45 through module
  • GbE RJ45 through ASPEED AST2600

Postcode

4x 7-Segment Postcode LEDs connected to PD I2C

Operating Temperature

Operating Temp.: -40°C … +85°C | Storage Temp.: -40°C … +85°C

Power Input

ATX connector, 12V/GND banana jacks

Humidity

Operating Hum.: 10% … 90% r. H. non cond. Storage Hum.: 5% … 95% r. H. non cond.

Size

304.8 x 330.2 mm (approx. 12 x 13 inches)

Size

304.8 x 330.2 mm (approx. 12 x 13 inches)

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