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System Industrie
Electronic GmbH

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System Industrie
Electronic Deutschland GmbH

+49 87 1965 7807 0
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Products > Integration-ready modules & platforms > COM-HPC Modules > conga-HPC/sILH
1Specifications 2Part Number

Formfactor

COM-HPC

embedded BIOS Features

AMI Aptio UEFI
64Mbyte serial SPI with congatec Embedded BIOS feature
OEM Logo
OEM CMOS Defaults
Flash Update

CPU

Intel® Xeon® D-2712T (4 x 1.9 GHz, 15 MB cache, 50G Eth, 65W)
Intel® Xeon® D-2733NT (8 x 2.1 GHz, 15 MB cache, 50G Eth, 80W)
Intel® Xeon® D-2752TER (12 x 1.8 GHz, 20 MB cache, 50G Eth, 77W)
Intel® Xeon® D-2775TE (16 x 2.0 GHz, 25 MB cache, 100G Eth, 100W)
Intel® Xeon® D-2796TE (20 x 2.0 GHz, 30 MB cache, 100G Eth, 118W)

Security

Trusted Platform Module (TPM 2.0)

DRAM

4x DIMM sockets for DDR4 memory modules | Max. capacity = 512GB*
*Optional 8 sockets on Size E, up to 1TB

Power Management

ACPI 5.0 with battery support

Ethernet

1 x 2.5GbE TSN Ethernet
2x 40G / 4x 25G / 8x 10G/2.5G/1G/100M lanes | Maximum total bandwidth 100Gb (depending on CPU)

Operating System

Microsoft® Windows® 10
Microsoft® Windows 10 IoT Enterprise
Microsoft® Windows IoT 10 Core
Linux
Android
Yocto
RTS Hypervisor

I/O Interfaces

32 x PCIe Gen4
16 x PCIe Gen3
4 x USB 3.0
4 x USB 2.0
2 x SATA III (6Gb/s)
2 x UART
12 x GPIOs
2 x SM-Bus
2 x I²C bus

Temperature

Commercial: Operating Temperature: 0 to +60°C | Storage Temperature: -20 to +80°C
Industrial: Operating Temperature: -40 to +80°C | Storage Temperature: -40 to +80°C

Humidity

Operating: 10 to 90% r. H. non cond. / Storage 5 to 95% r. H. non cond.

congatec Board Controller

Multi Stage Watchdog | non-volatile User Data Storage | Manufacturing and Board Information | Board Statistics | I²C bus (fast mode, 400 kHz, multi-master) | Power Loss Control | Hardware Health Monitoring | POST Code redirection

Size

160 x 160 mm
Optional available on Size E, 200 x 160mm

050900

conga-HPC/sILH-D2796TE

COM-HPC Size E module based on Intel® Xeon® D-2796TE 20-core processor with 2.0 GHz, 30MB cache and quad channel DDR4 2933 MT/s memory interface (formerly Ice Lake-D HCC). Industrial temperature range.

050901

conga-HPC/sILH-D2775TE

COM-HPC Size E module based on Intel® Xeon® D-2775TE 16-core processor with 2.0 GHz, 25MB cache and quad channel DDR4 2933 MT/s memory interface (formerly Ice Lake-D HCC). Industrial temperature range.

050902

conga-HPC/sILH-D2752TER

COM-HPC Size E module based on Intel® Xeon® D-2752TER 12-core processor with 1.8 GHz, 20MB cache and quad channel DDR4 2666 MT/s memory interface (formerly Ice Lake-D HCC). Industrial temperature range.

050910

conga-HPC/sILH-D2733NT

COM-HPC Size E module based on Intel® Xeon® D-2733NT 8-core processor with 2.1 GHz, 15MB cache and quad channel DDR4 2666 MT/s memory interface (formerly Ice Lake-D HCC). Commercial temperature range.

050911

conga-HPC/sILH-D2712T

COM-HPC Size E module based on Intel® Xeon® D-2712T 4-core processor with 1.9 GHz, 15MB cache and quad channel DDR4 2666 MT/s memory interface (formerly Ice Lake-D HCC). Commercial temperature range.

050950

conga-HPC/sILH-CSA-HP-B

Standard active cooling solution for COM-HPC Server modules conga-HPC/sILH with integrated heat pipes, 32.9mm overall cooling height and integrated 12V fan. Through hole mounting with bore hole standoffs Ø2.7mm.

050951

conga-HPC/sILH-CSA-HP-T

Standard active cooling solution for COM-HPC Server modules conga-HPC/sILH with integrated heat pipes, 32.9mm overall cooling height and integrated 12V fan. Threaded mounting with threaded standoffs M2.5.

050952

conga-HPC/sILH-HSP-HP-B

Standard heatspreader for COM-HPC Server modules conga-HPC/sILH with integrated heat pipes and 11mm overall cooling height. Through hole mounting with bore hole standoffs Ø2.7mm.

050953

conga-HPC/sILH-HSP-HP-T

Standard heatspreader for COM-HPC Server modules conga-HPC/sILH with integrated heat pipes and 11mm overall cooling height. Threaded mounting with threaded standoffs M2.5.

050954

conga-HPC/sILH-HPA-B

Heat pipe Adapter for COM-HPC Server modules conga-HPC/sILH. Suitable for standard 8 mm heat pipes to optimize heat distribution. Through hole mounting with bore hole standoffs Ø2.7mm.

050955

conga-HPC/sILH-HPA-T

Heat pipe Adapter for COM-HPC Server modules conga-HPC/sILH. Suitable for standard 8 mm heat pipes to optimize heat distribution. Threaded mounting with threaded standoffs M2.5.

050956

conga-HPC/sILH-Retention Frame

Retention frame for conga-HPC/sILH

065500

conga-HPC/EVAL-Server

conga-HPC/EVAL-Server

069000

DDR4-UDIMM-3200 (16GB)

DDR4 UDIMM memory module with 3200 MT/s and 16GB RAM

069003

DDR4-UDIMM-3200 (16GB)(ECC)

DDR4 ECC UDIMM memory module with 3200 MT/s and 16GB RAM

069002

DDR4-UDIMM-3200 (16GB) / i-temp

Industrial DDR4 UDIMM memory module with 3200 MT/s and 16GB RAM

069004

DDR4-UDIMM-3200 (16GB)(ECC) / i-temp

Industrial DDR4 ECC UDIMM memory module with 3200 MT/s and 16GB RAM

069001

DDR4-UDIMM-3200 (32GB)

DDR4 UDIMM memory module with 3200 MT/s and 32GB RAM

069006

DDR4-UDIMM-3200 (32GB)(ECC)

DDR4 ECC UDIMM memory module with 3200 MT/s and 32GB RAM

069005

DDR4-UDIMM-3200 (32GB) / i-temp

Industrial DDR4 UDIMM memory module with 3200 MT/s and 32GB RAM

069007

DDR4-UDIMM-3200 (32GB)(ECC) / i-temp

Industrial DDR4 ECC UDIMM memory module with 3200 MT/s and 32GB RAM

069200

DDR4-RDIMM-3200 (16GB)

DDR4 RDIMM memory module with 3200 MT/s and 16GB RAM

069210

DDR4-RDIMM-3200 (16GB) / i-temp

Industrial DDR4 RDIMM memory module with 3200 MT/s and 16GB RAM

069220

DDR4-RDIMM-3200 (32GB)

DDR4 RDIMM memory module with 3200 MT/s and 32GB RAM

069230

DDR4-RDIMM-3200 (32GB) / i-temp

Industrial DDR4 RDIMM memory module with 3200 MT/s and 32GB RAM

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