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Products > Integration-ready modules & platforms > COM Express > conga-TS570
1Specifications 2Part Number

Formfactor

COM Express Basic

CPU

Intel® Xeon® W-11155MLE (4 x 1.8 GHz, 8 MB cache, 25W)
Intel® Xeon® W-11555MLE (6 x 1.9 GHz, 12 MB cache, 25W)
Intel® Xeon® W-11865MLE (8 x 1.5 GHz, 24 MB cache, 25W)
Intel® Xeon® W-11155MRE (4 x 2.4 GHz, 8 MB cache, 45W)
Intel® Xeon® W-11555MRE (6 x 2.6 GHz, 12 MB cache, 45W)
Intel® Xeon® W-11865MRE (8 x 2.6 GHz, 24 MB cache, 45W)
Intel® Celeron® 6600HE (2 x 2.6 GHz, 8 MB cache, 35W)
Intel® Core™ i3-11100HE (4 x 2.4 GHz, 8 MB cache, 45W)
Intel® Core™ i5-11500HE (6 x 2.6 GHz, 12 MB cache, 45W)
Intel® Core™ i7-11850HE (8 x 2.6 GHz, 24 MB cache, 45W)

DRAM

Up to 3 SO-DIMM sockets for DDR4 ECC memory modules up to 32 GByte each (96 GByte total) with 3200 MT/s

Ethernet

1 x 2.5 GbE with TSN support via Intel® i226 Ethernet controller series

I/O Interfaces

8 x PCIe Gen3
LPC bus
8 x GPIOs
2 x UART
SPI
4 x SATA III (6Gb/s)
8 x USB 2.0
4 x USB 3.1 Gen2
PEG support x16 (PCIe Gen4)
I²C bus

Graphics

Integrated Xe (Gen 12) graphics engine with up to 32 EU (Execution Units) | Supporting 4 independent display units (4x 4k/2x 8K) | Enhanced media (AV1/12b) with up to 2 Vdbox | Next Gen IPU6 with DPHY2.1 | DP 1.4

congatec Board Controller

Multi Stage Watchdog | non-volatile User Data Storage | Manufacturing and Board Information | Board Statistics | I²C bus (fast mode, 400 kHz, multi-master) | Power Loss Control | Hardware Health Monitoring | POST Code redirection

embedded BIOS Features

AMI Aptio UEFI
32 MByte serial SPI firmware flash
OEM Logo
OEM CMOS Defaults
LCD Control
Display Auto Detection
Backlight Control
Flash Update

Security

Trusted Platform Module (TPM 2.0)

Power Management

ACPI 6.0 with battery support

Operating System

Microsoft® Windows® 10
Microsoft® Windows 10 IoT Enterprise
Linux
Yocto

Hypervisor

RTS Real-Time Hypervisor

Temperature

Commercial: Operating: 0 to +60°C | Storage: -20 to +80°C
Industrial: Operating: -40 to +85°C | Storage: -40 to +85°C

Humidity

Operating: 10 to 90% r. H. non cond. / Storage 5 to 95% r. H. non cond.

Video Interfaces

3x DP/DP++ | 1x eDP /LVDS

Size

95 x 125 mm (3.74″ x 4.92″)

050700

conga-TS570/i7-11850HE

COM Express Type 6 Basic module based on Intel® Core™ i7-11850HE 8-core processor with 2.6GHz up to 4.7GHz turbo boost, 24MB Intel® Smart Cache, Intel® UHD Graphics with 32EU and dual channel DDR4 3200 MT/s memory interface. | Chipset QM580E | Intel® Tiger Lake-H | Commercial temperature range

050701

conga-TS570/i5-11500HE

COM Express Type 6 Basic module based on Intel® Core™ i5-11500HE 6-core processor with 2.6GHz up to 4.5GHz turbo boost, 12MB Intel® Smart Cache, Intel® UHD Graphics with 32EU and dual channel DDR4 3200 MT/s memory interface. | Chipset QM580E | Intel® Tiger Lake-H | Commercial temperature range

050702

conga-TS570/i3-11100HE

COM Express Type 6 Basic module based on Intel® Core™ i3-11100HE 4-core processor with 2.4GHz up to 4.4GHz turbo boost, 8MB Intel® Smart Cache, Intel® UHD Graphics with 16EU and dual channel DDR4 3200 MT/s memory interface. | Chipset HM570E | Intel® Tiger Lake-H | Commercial temperature range

050703

conga-TS570/6600HE

COM Express Type 6 Basic module based on Intel® Celeron® 6600HE 2-core processor with 2.6GHz base frequency, 8MB Intel® Smart Cache, Intel® UHD Graphics with 16EU and dual channel DDR4 3200 MT/s memory interface. | Chipset HM570E | Intel® Tiger Lake-H | Commercial temperature range

050710

conga-TS570/W-11865MRE

COM Express Type 6 Basic module based on Intel® Xeon® W-11865MRE 8-core processor with 2.6GHz up to 4.7GHz turbo boost, 24MB Intel® Smart Cache, Intel® UHD Graphics with 32EU and dual channel DDR4 3200 MT/s memory interface. | Chipset RM590E | Intel® Tiger Lake-H | Industrial temperature range

050711

conga-TS570/W-11555MRE

COM Express Type 6 Basic module based on Intel® Xeon® W-11555MRE 6-core processor with 2.6GHz up to 4.5GHz turbo boost, 12MB Intel® Smart Cache, Intel® UHD Graphics with 32EU and dual channel DDR4 3200 MT/s memory interface. | Chipset RM590E | Intel® Tiger Lake-H | Industrial temperature range

050712

conga-TS570/W-11155MRE

COM Express Type 6 Basic module based on Intel® Xeon® W-11155MRE 4-core processor with 2.4GHz up to 4.4GHz turbo boost, 8MB Intel® Smart Cache, Intel® UHD Graphics with 16EU and dual channel DDR4 3200 MT/s memory interface. | Chipset RM590E | Intel® Tiger Lake-H | Industrial temperature range

050713

conga-TS570/W-11865MLE

COM Express Type 6 Basic module based on Intel® Xeon® W-11865MLE 8-core processor with 1.5GHz up to 4.5GHz turbo boost, 24MB Intel® Smart Cache, Intel® UHD Graphics with 32EU and dual channel DDR4 3200 MT/s memory interface. | Chipset RM590E | Intel® Tiger Lake-H | Commercial temperature range

050714

conga-TS570/W-11555MLE

COM Express Type 6 Basic module based on Intel® Xeon® W-11555MLE 6-core processor with 1.9GHz up to 4.4GHz turbo boost, 12MB Intel® Smart Cache, Intel® UHD Graphics with 32EU and dual channel DDR4 3200 MT/s memory interface. | Chipset RM590E | Intel® Tiger Lake-H | Commercial temperature range

050715

conga-TS570/W-11155MLE

COM Express Type 6 Basic module based on Intel® Xeon® W-11155MRE 4-core processor with 1.8GHz up to 3.1GHz turbo boost, 8MB Intel® Smart Cache, Intel® UHD Graphics with 16EU and dual channel DDR4 3200 MT/s memory interface. | Chipset RM590E | Intel® Tiger Lake-H | Commercial temperature range

050750

conga-TS570/CSA-HP-B

Standard active cooling solution for high performance COM Express module conga-TS570 with integrated heat pipes, 29mm overall heat sink height and integrated 12V fan. All standoffs are with 2.7mm bore hole.

050751

conga-TS570/CSA-HP-T

Standard active cooling solution for high performance COM Express module conga-TS570 with integrated heat pipes, 29mm overall heat sink height and integrated 12V fan. All standoffs are M2.5mm thread.

050752

conga-TS570/CSP-HP-B

Standard passive cooling solution for high performance COM Express module conga-TS570 with integrated heat pipes, 28mm overall heat sink height. All standoffs are with 2.7mm bore hole.

050753

conga-TS570/CSP-HP-T

Standard passive cooling solution for high performance COM Express module conga-TS570 with integrated heat pipes, 28mm overall heat sink height. All standoffs are M2.5mm thread.

050754

conga-TS570/HSP-HP-B

Standard heatspreader for high performance COM Express module conga-TS570 with integrated heat pipes, 11mm overall heat sink height. All standoffs are with 2.7mm bore hole.

050755

conga-TS570/HSP-HP-T

Standard heatspreader for high performance COM Express module conga-TS570 with integrated heat pipes, 11mm overall heat sink height. All standoffs are M2.5mm thread.

050756

conga-TS570/HPA

Standard heatpipe adapter for high performance COM Express module conga-TS570.

065810

conga-TEVAL/COMe 3.0

Evaluation Carrier Board for COM Express Type 6 modules.

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