COM Express Compact


COM Express Type 6 Compact module based on AMD Embedded Ryzen V2000 embedded processor series
Formfactor
COM Express Compact
CPU
DRAM
Up to 2 SO-DIMM sockets for DDR4 memory modules up to 32 GByte each (64 GByte total) with 3200 MT/s
Ethernet
1 x Gigabit Ethernet via Intel® i226
I/O Interfaces
Graphics
Integrated Radeon™ graphics engine with up to 7 Compute Units | Supporting 4 independent display units (4x 4K) | DirectX 12 support | VCN2.2 (H.264/AVC HW 8b | H.265/HEVC HW 8/10b | VP9 HW 8/10b) | DP 1.4
embedded BIOS Features
Security
Trusted Platform Module (TPM 2.0) | AMD Secure Processor | AMD Memory Guard
Power Management
ACPI 5.0 with battery support
Operating Systems
Hypervisor
RTS Real-Time Hypervisor
Temperature
Commercial: Operating Temperature: 0 to +60°C | Storage Temperature: -20 to +80°C
Humidity
Operating: 10 to 90% r. H. non cond. / Storage 5 to 95% r. H. non cond.
Video Interfaces
Size
95 x 95 mm (3,74″ x 3,74″)
050500
conga-TCV2/V2748
COM Express Type 6 Compact module based on AMD Embedded Ryzen V2748 8 core processor with 2.9GHz up to 4.25GHz turbo boost, 4MB L2 cache, Radeon Vega7 Graphics with 7 CU and dual channel DDR4 3200 MT/s memory interface with ECC support. Commercial temperature range.
050501
conga-TCV2/V2546
COM Express Type 6 Compact module based on AMD Embedded Ryzen V2546 6 core processor with 3.0GHz up to 3.95GHz turbo boost, 3MB L2 cache, Radeon Vega6 Graphics with 6 CU and dual channel DDR4 3200 MT/s memory interface with ECC support. Commercial temperature range.
050502
conga-TCV2/V2718
COM Express Type 6 Compact module based on AMD Embedded Ryzen V2718 8 core processor with 1.7GHz up to 4.15GHz turbo boost, 4MB L2 cache, Radeon Vega7 Graphics with 7 CU and dual channel DDR4 3200 MT/s memory interface with ECC support. Commercial temperature range.
050503
conga-TCV2/V2516
COM Express Type 6 Compact module based on AMD Embedded Ryzen V2516 6 core processor with 2.1GHz up to 3.95GHz turbo boost, 3MB L2 cache, Radeon Vega6 Graphics with 6 CU and dual channel DDR4 3200 MT/s memory interface with ECC support. Commercial temperature range.
050550
conga-TCV2/CSA-HP-B
Standard active cooling solution for high performance COM Express module conga-TCV2 with integrated heat pipes, 25.5mm overall heat sink height and integrated 12V fan. All standoffs are with 2.7mm bore hole.
050551
conga-TCV2/CSA-HP-T
Standard active cooling solution for high performance COM Express module conga-TCV2 with integrated heat pipes, 25.5mm overall heat sink height and integrated 12V fan. All standoffs are M2.5mm thread.
050552
conga-TCV2/CSP-HP-B
Standard passive cooling solution for high performance COM Express module conga-TCV2 with integrated heat pipes, 24.3mm overall heat sink height. All standoffs are with 2.7mm bore hole.
050553
conga-TCV2/CSP-HP-T
Standard passive cooling solution for high performance COM Express module conga-TCV2 with integrated heat pipes, 24.3mm overall heat sink height. All standoffs are M2.5mm thread.
050554
conga-TCV2/HSP-HP-B
Standard heatspreader for high performance COM Express module conga-TCV2 with integrated heat pipes, 11mm overall heat sink height. All standoffs are with 2.7mm bore hole.
050555
conga-TCV2/HSP-HP-T
Standard heatspreader for high performance COM Express module conga-TCV2 with integrated heat pipes, 11mm overall heat sink height. All standoffs are M2.5mm thread.
65810
conga-TEVAL/COMe 3.0
Evaluation Carrier Board for COM Express Type 6 modules.
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