S.I.E Produkt-Portfolio

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Formfactor

COM Express Compact

CPU

AMD Ryzen Embedded V2516 (6 x 2.1 GHz, 3MB L2 cache, 10W)

AMD Ryzen Embedded V2546 (6 x 3 GHz, 3MB L2 cache, 35W)

AMD Ryzen Embedded V2718 (8 x 1.7 GHz, 4MB L2 cache, 10W)

AMD Ryzen Embedded V2748 (8 x 2.9 GHz, 4MB L2 cache, 35W)

DRAM

Up to 2 SO-DIMM sockets for DDR4 memory modules up to 32 GByte each (64 GByte total) with 3200 MT/s

Ethernet

1 x Gigabit Ethernet via Intel® i226

I/O Interfaces

5 x PCIe Gen3 (8 lanes)

PEG support x8

4 x USB 3.1 Gen2

8/4x USB 2.0

2 x SATA III (6Gb/s)

2 x UART

8 x GPIOs

LPC bus

Graphics

embedded BIOS Features

AMI Aptio® UEFI firmware

16 Mbyte serial SPI with congatec Embedded BIOS feature

OEM Logo

OEM CMOS Defaults

LCD Control

Display Auto Detection

Backlight Control

Flash Update

Security

Trusted Platform Module (TPM 2.0) | AMD Secure Processor | AMD Memory Guard

Power Management

ACPI 5.0 with battery support

Operating Systems

Microsoft® Windows® 10

Microsoft® Windows 10 IoT Enterprise

Ubuntu Linux LTS

Hypervisor

RTS Real-Time Hypervisor

Temperature

Commercial: Operating Temperature: 0 to +60°C | Storage Temperature: -20 to +80°C

Humidity

Operating: 10 to 90% r. H. non cond. / Storage 5 to 95% r. H. non cond.

Video Interfaces

3 x DP/DP++

1 x LVDS up to FullHD 1920×1200@60Hz

eDP (optional)

Size

95 x 95 mm (3,74″ x 3,74″)

050500

conga-TCV2/V2748

COM Express Type 6 Compact module based on AMD Embedded Ryzen V2748 8 core processor with 2.9GHz up to 4.25GHz turbo boost, 4MB L2 cache, Radeon Vega7 Graphics with 7 CU and dual channel DDR4 3200 MT/s memory interface with ECC support. Commercial temperature range.

050501

conga-TCV2/V2546

COM Express Type 6 Compact module based on AMD Embedded Ryzen V2546 6 core processor with 3.0GHz up to 3.95GHz turbo boost, 3MB L2 cache, Radeon Vega6 Graphics with 6 CU and dual channel DDR4 3200 MT/s memory interface with ECC support. Commercial temperature range.

050502

conga-TCV2/V2718

COM Express Type 6 Compact module based on AMD Embedded Ryzen V2718 8 core processor with 1.7GHz up to 4.15GHz turbo boost, 4MB L2 cache, Radeon Vega7 Graphics with 7 CU and dual channel DDR4 3200 MT/s memory interface with ECC support. Commercial temperature range.

050503

conga-TCV2/V2516

COM Express Type 6 Compact module based on AMD Embedded Ryzen V2516 6 core processor with 2.1GHz up to 3.95GHz turbo boost, 3MB L2 cache, Radeon Vega6 Graphics with 6 CU and dual channel DDR4 3200 MT/s memory interface with ECC support. Commercial temperature range.

050550

conga-TCV2/CSA-HP-B

Standard active cooling solution for high performance COM Express module conga-TCV2 with integrated heat pipes, 25.5mm overall heat sink height and integrated 12V fan. All standoffs are with 2.7mm bore hole.

050551

conga-TCV2/CSA-HP-T

050552

conga-TCV2/CSP-HP-B

Standard passive cooling solution for high performance COM Express module conga-TCV2 with integrated heat pipes, 24.3mm overall heat sink height. All standoffs are with 2.7mm bore hole.

050553

conga-TCV2/CSP-HP-T

Standard passive cooling solution for high performance COM Express module conga-TCV2 with integrated heat pipes, 24.3mm overall heat sink height. All standoffs are M2.5mm thread.

050554

conga-TCV2/HSP-HP-B

Standard heatspreader for high performance COM Express module conga-TCV2 with integrated heat pipes, 11mm overall heat sink height. All standoffs are with 2.7mm bore hole.

050555

conga-TCV2/HSP-HP-T

Standard heatspreader for high performance COM Express module conga-TCV2 with integrated heat pipes, 11mm overall heat sink height. All standoffs are M2.5mm thread.

65810

conga-TEVAL/COMe 3.0

Evaluation Carrier Board for COM Express Type 6 modules.

conga-TCV2

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