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Products > Integration-ready modules & platforms > COM Express > conga-TCV2
1Specifications 2Part Number

Formfactor

COM Express Compact

embedded BIOS Features

OEM Customization
Flash Update
AMI Aptio UEFI

CPU

AMD Ryzen Embedded V2516 (6 x 2.1 GHz, 3MB L2 cache, 10W)
AMD Ryzen Embedded V2546 (6 x 3 GHz, 3MB L2 cache, 35W)
AMD Ryzen Embedded V2718 (8 x 1.7 GHz, 4MB L2 cache, 10W)
AMD Ryzen Embedded V2748 (8 x 2.9 GHz, 4MB L2 cache, 35W)

Security

Trusted Platform Module (TPM 2.0)

DRAM

Up to 2 SO-DIMM sockets for DDR4 memory modules up to 32 GByte each (64 GByte total) with 3200 MT/s

Power Management

ACPI 5.0 with battery support

Ethernet

1x 2,5GbE TSN Ethernet via Intel® i225

Operating Systems

Microsoft® Windows® 10
Microsoft® Windows 10 IoT Enterprise
Linux
Ubuntu
RTS Hypervisor

I/O Interfaces

8 x PCIe Gen3
PEG support x8
2 x USB 3.1 Gen2
8 x USB 2.0
2 x SATA III (6Gb/s)
SPI
2 x UART
8 x GPIOs

Temperature

Commercial: Operating: 0 to +60°C | Storage: -40 to +85°C

Humidity

Operating: 10 to 90% r. H. non cond. / Storage 5 to 95% r. H. non cond.

Graphics

Integrated VEGA 7 graphics engine with up to 7 Compute Units | Supporting 4 independent display units (4x 4K) | DirectX 12 support | VCN2.2 (H.264/AVC HW 8b | H.265/HEVC HW 8/10b | VP9 HW 8/10b) | DP 1.4

Video Interfaces

3x DP/DP++ | 1x eDP /LVDS

Size

95 x 95 mm (3,74″ x 3,74″)

050500

conga-TCV2/V2748

COM Express Type 6 Compact module based on AMD Embedded Ryzen V2748 8 core processor with 2.9GHz up to 4.25GHz turbo boost, 4MB L2 cache, Radeon Vega7 Graphics with 7 CU and dual channel DDR4 3200 MT/s memory interface with ECC support. Commercial temperature range.

050501

conga-TCV2/V2546

COM Express Type 6 Compact module based on AMD Embedded Ryzen V2546 6 core processor with 3.0GHz up to 3.95GHz turbo boost, 3MB L2 cache, Radeon Vega6 Graphics with 6 CU and dual channel DDR4 3200 MT/s memory interface with ECC support. Commercial temperature range.

050502

conga-TCV2/V2718

COM Express Type 6 Compact module based on AMD Embedded Ryzen V2718 8 core processor with 1.7GHz up to 4.15GHz turbo boost, 4MB L2 cache, Radeon Vega7 Graphics with 7 CU and dual channel DDR4 3200 MT/s memory interface with ECC support. Commercial temperature range.

050503

conga-TCV2/V2516

COM Express Type 6 Compact module based on AMD Embedded Ryzen V2516 6 core processor with 2.1GHz up to 3.95GHz turbo boost, 3MB L2 cache, Radeon Vega6 Graphics with 6 CU and dual channel DDR4 3200 MT/s memory interface with ECC support. Commercial temperature range.

050550

conga-TCV2/CSA-HP-B

Standard active cooling solution for high performance COM Express module conga-TCV2 with integrated heat pipes, 25.5mm overall heat sink height and integrated 12V fan. All standoffs are with 2.7mm bore hole.

050551

conga-TCV2/CSA-HP-T

Standard active cooling solution for high performance COM Express module conga-TCV2 with integrated heat pipes, 25.5mm overall heat sink height and integrated 12V fan. All standoffs are M2.5mm thread.

050552

conga-TCV2/CSP-HP-B

Standard passive cooling solution for high performance COM Express module conga-TCV2 with integrated heat pipes, 24.3mm overall heat sink height. All standoffs are with 2.7mm bore hole.

050553

conga-TCV2/CSP-HP-T

Standard passive cooling solution for high performance COM Express module conga-TCV2 with integrated heat pipes, 24.3mm overall heat sink height. All standoffs are M2.5mm thread.

050554

conga-TCV2/HSP-HP-B

Standard heatspreader for high performance COM Express module conga-TCV2 with integrated heat pipes, 11mm overall heat sink height. All standoffs are with 2.7mm bore hole.

050555

conga-TCV2/HSP-HP-T

Standard heatspreader for high performance COM Express module conga-TCV2 with integrated heat pipes, 11mm overall heat sink height. All standoffs are M2.5mm thread.

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