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Products > Integration-ready modules & platforms > COM-HPC Modules > conga-HPC/cTLH
1Specifications 2Part Number

Formfactor

COM-HPC

embedded BIOS Features

AMI Aptio UEFI
32 MByte serial SPI firmware flash
OEM Logo
OEM CMOS Defaults
LCD Control
Display Auto Detection
Backlight Control
Flash Update

CPU

Intel® Xeon® W-11155MLE (4 x 1.8 GHz, 8 MB cache, 25W)
Intel® Xeon® W-11555MLE (6 x 1.9 GHz, 12 MB cache, 25W)
Intel® Xeon® W-11865MLE (8 x 1.5 GHz, 24 MB cache, 25W)
Intel® Xeon® W-11155MRE (4 x 2.4 GHz, 8 MB cache, 45W)
Intel® Xeon® W-11555MRE (6 x 2.6 GHz, 12 MB cache, 45W)
Intel® Xeon® W-11865MRE (8 x 2.6 GHz, 24 MB cache, 45W)
Intel® Celeron® 6600HE (2 x 2.6 GHz, 8 MB cache, 35W)
Intel® Core™ i3-11100HE (4 x 2.4 GHz, 8 MB cache, 45W)
Intel® Core™ i5-11500HE (6 x 2.6 GHz, 12 MB cache, 45W)
Intel® Core™ i7-11850HE (8 x 2.6 GHz, 24 MB cache, 45W)

Security

Trusted Platform Module (TPM 2.0)

DRAM

Up to 4 SO-DIMM sockets for DDR4 ECC memory modules up to 32 GByte each (128 GByte total) with 3200 MT/s

Power Management

ACPI 6.0 with battery support

Ethernet

2 x 2.5 GbE TSN Ethernet via Intel® i225

Operating System

Microsoft® Windows® 10
Microsoft® Windows 10 IoT Enterprise
Linux
Yocto
RTS Hypervisor

I/O Interfaces

4 x PCIe Gen4
PEG support x16 (PCIe Gen4)
20 x PCIe Gen3
2 x USB 4.0
2 x USB 3.2
8 x USB 2.0
2 x SATA III (6Gb/s)
eSPI
2 x UART
12 x GPIOs
I²C bus
4 x MIPI-CSI

Temperature

Industrial: Operating: -40 to +85°C | Storage: -40 to +85°C
Commercial: Operating: 0 to +60°C | Storage: -40 to +85°C

Humidity

Operating: 10 to 90% r. H. non cond. / Storage 5 to 95% r. H. non cond.

Graphics

Integrated Xe (Gen 12) graphics engine with up to 32 EU (Execution Units) | Supporting 4 independent display units (4x 4k/2x 8K) | Enhanced media (AV1/12b) with up to 2 Vdbox | Next Gen IPU6 with DPHY2.1 | DP 1.4

Video Interfaces

3x DP/DP++ | 1x eDP /LVDS

congatec Board Controller

Multi Stage Watchdog | non-volatile User Data Storage | Manufacturing and Board Information | Board Statistics | I²C bus (fast mode, 400 kHz, multi-master) | Power Loss Control | Hardware Health Monitoring | POST Code redirection

Size

120 x 120 mm²

050800

conga-HPC/cTLH-i7-11850HE

COM HPC Size B module based on Intel® Core™ i7-11850HE 8-core processor with 2.6GHz up to 4.7GHz turbo boost, 24MB Intel® Smart Cache, Intel® UHD Graphics with 32EU and dual channel DDR4 3200 MT/s memory interface. | Chipset QM580E | Intel® Tiger Lake-H | Commercial temperature range

050801

conga-HPC/cTLH-i5-11500HE

COM HPC Size B module based on Intel® Core™ i5-11500HE 6-core processor with 2.6GHz up to 4.5GHz turbo boost, 12MB Intel® Smart Cache, Intel® UHD Graphics with 32EU and dual channel DDR4 3200 MT/s memory interface. | Chipset QM580E | Intel® Tiger Lake-H | Commercial temperature range

050802

conga-HPC/cTLH-i3-11100HE

COM HPC Size B module based on Intel® Core™ i3-11100HE 4-core processor with 2.4GHz up to 4.4GHz turbo boost, 8MB Intel® Smart Cache, Intel® UHD Graphics with 16EU and dual channel DDR4 3200 MT/s memory interface. | Chipset HM570E | Intel® Tiger Lake-H | Commercial temperature range

050803

conga-HPC/cTLH-6600HE

COM HPC Size B module based on Intel® Celeron 6600HE 2-core processor with 2.6GHz base frequency, 8MB Intel® Smart Cache, Intel® UHD Graphics with 16EU and dual channel DDR4 3200 MT/s memory interface. | Chipset HM570E | Intel® Tiger Lake-H | Commercial temperature range

050810

conga-HPC/cTLH-W-11865MRE

COM HPC Size B module based on Intel® Xeon® W-11865MRE 8-core processor with 2.6GHz up to 4.7GHz turbo boost, 24MB Intel® Smart Cache, Intel® UHD Graphics with 32EU and dual channel DDR4 3200 MT/s memory interface. | Chipset RM590E | Intel® Tiger Lake-H | Industrial temperature range

050811

conga-HPC/cTLH-W-11555MRE

COM HPC Size B module based on Intel® Xeon® W-11555MRE 6-core processor with 2.6GHz up to 4.5GHz turbo boost, 12MB Intel® Smart Cache, Intel® UHD Graphics with 32EU and dual channel DDR4 3200 MT/s memory interface. | Chipset RM590E | Intel® Tiger Lake-H | Industrial temperature range

050812

conga-HPC/cTLH-W-11155MRE

COM HPC Size B module based on Intel® Xeon® W-11155MRE 4-core processor with 2.4GHz up to 4.4GHz turbo boost, 8MB Intel® Smart Cache, Intel® UHD Graphics with 16EU and dual channel DDR4 3200 MT/s memory interface. | Chipset RM590E | Intel® Tiger Lake-H | Industrial temperature range

050813

conga-HPC/cTLH-W-11865MLE

COM HPC Size B module based on Intel® Xeon® W-11865MLE 8-core processor with 1.5GHz up to 4.5GHz turbo boost, 24MB Intel® Smart Cache, Intel® UHD Graphics with 32EU and dual channel DDR4 3200 MT/s memory interface. | Chipset RM590E | Intel® Tiger Lake-H | Commercial temperature range

050814

conga-HPC/cTLH-W-11555MLE

COM HPC Size B module based on Intel® Xeon® W-11555MLE 6-core processor with 1.9GHz up to 4.4GHz turbo boost, 12MB Intel® Smart Cache, Intel® UHD Graphics with 32EU and dual channel DDR4 3200 MT/s memory interface. | Chipset RM590E | Intel® Tiger Lake-H | Commercial temperature range

050815

conga-HPC/cTLH-W-11155MLE

COM HPC Size B module based on Intel® Xeon® W-11155MRE 4-core processor with 1.8GHz up to 3.1GHz turbo boost, 8MB Intel® Smart Cache, Intel® UHD Graphics with 16EU and dual channel DDR4 3200 MT/s memory interface. | Chipset RM590E | Intel® Tiger Lake-H | Commercial temperature range

050850

conga-HPC/cTLH-CSA-HP-B

Standard active cooling solution for high performance COM-HPC module conga-HPC/cTLH with integrated heatpipe, 29mm height and integrated 12V fan. All standoffs are with 2.7mm bore hole.

050851

conga-HPC/cTLH-CSA-HP-T

Standard active cooling solution for high performance COM-HPC module conga-HPC/cTLH with integrated heatpipe, 29mm height and integrated 12V fan. All standoffs are M2.5mm thread.

050852

conga-HPC/cTLH-CSP-HP-B

Standard passive cooling solution for high performance COM-HPC module conga-HPC/cTLH with integrated heatpipe, 29mm height. All standoffs are with 2.7mm bore hole.

050853

conga-HPC/cTLH-CSP-HP-T

Standard passive cooling solution for high performance COM-HPC module conga-HPC/cTLH with integrated heatpipe, 29mm height. All standoffs are with M2.5mm thread.

050854

conga-HPC/cTLH-HSP-HP-B

Standard heatspreader for high performance COM-HPC module conga-HPC/cTLH with integrated heatpipe, 13mm height. All standoffs are with 2.7mm bore hole.

050855

conga-HPC/cTLH-HSP-HP-T

Standard heatspreader solution for high performance COM-HPC module conga-HPC/cTLH with integrated heatpipe, 13mm height. All standoffs are with M2.5mm thread.

065600

conga-HPC/EVAL-Client

Evaluation Carrier Board for COM-HPC Client type Modules.

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