S.I.E Produkt-Portfolio - conga-HPC/cTLH

1Spezifikationen 2Teilenummer

Formfactor

COM-HPC

CPU

Intel® Xeon® W-11155MLE (4 x 1.8 GHz, 8 MB cache, 25W)

Intel® Xeon® W-11555MLE (6 x 1.9 GHz, 12 MB cache, 25W)

Intel® Xeon® W-11865MLE (8 x 1.5 GHz, 24 MB cache, 25W)

Intel® Xeon® W-11155MRE (4 x 2.4 GHz, 8 MB cache, 45W)

Intel® Xeon® W-11555MRE (6 x 2.6 GHz, 12 MB cache, 45W)

Intel® Xeon® W-11865MRE (8 x 2.6 GHz, 24 MB cache, 45W)

Intel® Celeron® 6600HE (2 x 2.6 GHz, 8 MB cache, 35W)

Intel® Core™ i3-11100HE (4 x 2.4 GHz, 8 MB cache, 45W)

Intel® Core™ i5-11500HE (6 x 2.6 GHz, 12 MB cache, 45W)

Intel® Core™ i7-11850HE (8 x 2.6 GHz, 24 MB cache, 45W)

DRAM

Up to 4 SO-DIMM sockets for DDR4 ECC memory modules up to 32 GByte each (128 GByte total) with 3200 MT/s

Ethernet

2 x 2.5 GbE with TSN support via Intel® i226 Ethernet controller series

I/O Interfaces

4 x PCIe Gen4

I²C bus

12 x GPIOs

2 x UART

eSPI

2 x SATA III (6Gb/s)

8 x USB 2.0

2 x USB 3.2

2 x USB 4.0

20 x PCIe Gen3

PEG support x16 (PCIe Gen4)

4 x MIPI-CSI

Graphics

Integrated Xe (Gen 12) graphics engine with up to 32 EU (Execution Units) | Supporting 4 independent display units (4x 4k/2x 8K) | Enhanced media (AV1/12b) with up to 2 Vdbox | Next Gen IPU6 with DPHY2.1 | DP 1.4

congatec Board Controller

embedded BIOS Features

AMI Aptio UEFI

32 MByte serial SPI firmware flash

OEM Logo

OEM CMOS Defaults

LCD Control

Display Auto Detection

Backlight Control

Flash Update

Security

Trusted Platform Module (TPM 2.0)

Power Management

ACPI 6.0 with battery support

Operating System

Microsoft® Windows® 10

Microsoft® Windows 10 IoT Enterprise

Linux

Yocto

Hypervisor

RTS Real-Time Hypervisor

Temperature

Industrial: Operating: -40 to +85°C | Storage: -40 to +85°C
Commercial: Operating: 0 to +60°C | Storage: -40 to +85°C

Humidity

Operating: 10 to 90% r. H. non cond. / Storage 5 to 95% r. H. non cond.

Video Interfaces

3x DP/DP++ | 1x eDP /LVDS

Size

120 x 120 mm²

050800

conga-HPC/cTLH-i7-11850HE

COM-HPC Size B module based on Intel® Core™ i7-11850HE 8-core processor with 2.6GHz up to 4.7GHz turbo boost, 24MB Intel® Smart Cache, Intel® UHD Graphics with 32EU and dual channel DDR4 3200 MT/s memory interface. | Chipset QM580E | Intel® Tiger Lake-H | Commercial temperature range

050801

conga-HPC/cTLH-i5-11500HE

COM-HPC Size B module based on Intel® Core™ i5-11500HE 6-core processor with 2.6GHz up to 4.5GHz turbo boost, 12MB Intel® Smart Cache, Intel® UHD Graphics with 32EU and dual channel DDR4 3200 MT/s memory interface. | Chipset QM580E | Intel® Tiger Lake-H | Commercial temperature range

050802

conga-HPC/cTLH-i3-11100HE

COM-HPC Size B module based on Intel® Core™ i3-11100HE 4-core processor with 2.4GHz up to 4.4GHz turbo boost, 8MB Intel® Smart Cache, Intel® UHD Graphics with 16EU and dual channel DDR4 3200 MT/s memory interface. | Chipset HM570E | Intel® Tiger Lake-H | Commercial temperature range

050803

conga-HPC/cTLH-6600HE

COM-HPC Size B module based on Intel® Celeron 6600HE 2-core processor with 2.6GHz base frequency, 8MB Intel® Smart Cache, Intel® UHD Graphics with 16EU and dual channel DDR4 3200 MT/s memory interface. | Chipset HM570E | Intel® Tiger Lake-H | Commercial temperature range

050810

conga-HPC/cTLH-W-11865MRE

COM-HPC Size B module based on Intel® Xeon® W-11865MRE 8-core processor with 2.6GHz up to 4.7GHz turbo boost, 24MB Intel® Smart Cache, Intel® UHD Graphics with 32EU and dual channel DDR4 3200 MT/s memory interface. | Chipset RM590E | Intel® Tiger Lake-H | Industrial temperature range

050811

conga-HPC/cTLH-W-11555MRE

COM-HPC Size B module based on Intel® Xeon® W-11555MRE 6-core processor with 2.6GHz up to 4.5GHz turbo boost, 12MB Intel® Smart Cache, Intel® UHD Graphics with 32EU and dual channel DDR4 3200 MT/s memory interface. | Chipset RM590E | Intel® Tiger Lake-H | Industrial temperature range

050812

conga-HPC/cTLH-W-11155MRE

COM-HPC Size B module based on Intel® Xeon® W-11155MRE 4-core processor with 2.4GHz up to 4.4GHz turbo boost, 8MB Intel® Smart Cache, Intel® UHD Graphics with 16EU and dual channel DDR4 3200 MT/s memory interface. | Chipset RM590E | Intel® Tiger Lake-H | Industrial temperature range

050813

conga-HPC/cTLH-W-11865MLE

COM-HPC Size B module based on Intel® Xeon® W-11865MLE 8-core processor with 1.5GHz up to 4.5GHz turbo boost, 24MB Intel® Smart Cache, Intel® UHD Graphics with 32EU and dual channel DDR4 3200 MT/s memory interface. | Chipset RM590E | Intel® Tiger Lake-H | Commercial temperature range

050814

conga-HPC/cTLH-W-11555MLE

COM-HPC Size B module based on Intel® Xeon® W-11555MLE 6-core processor with 1.9GHz up to 4.4GHz turbo boost, 12MB Intel® Smart Cache, Intel® UHD Graphics with 32EU and dual channel DDR4 3200 MT/s memory interface. | Chipset RM590E | Intel® Tiger Lake-H | Commercial temperature range

050815

conga-HPC/cTLH-W-11155MLE

COM-HPC Size B module based on Intel® Xeon® W-11155MRE 4-core processor with 1.8GHz up to 3.1GHz turbo boost, 8MB Intel® Smart Cache, Intel® UHD Graphics with 16EU and dual channel DDR4 3200 MT/s memory interface. | Chipset RM590E | Intel® Tiger Lake-H | Commercial temperature range

050850

conga-HPC/cTLH-CSA-HP-B

Standard active cooling solution for high performance COM-HPC module conga-HPC/cTLH with integrated heatpipe, 29mm height and integrated 12V fan. All standoffs are with 2.7mm bore hole.

050851

conga-HPC/cTLH-CSA-HP-T

Standard active cooling solution for high performance COM-HPC module conga-HPC/cTLH with integrated heatpipe, 29mm height and integrated 12V fan. All standoffs are M2.5mm thread.

050852

conga-HPC/cTLH-CSP-HP-B

Standard passive cooling solution for high performance COM-HPC module conga-HPC/cTLH with integrated heatpipe, 29mm height. All standoffs are with 2.7mm bore hole.

050853

conga-HPC/cTLH-CSP-HP-T

Standard passive cooling solution for high performance COM-HPC module conga-HPC/cTLH with integrated heatpipe, 29mm height. All standoffs are with M2.5mm thread.

050854

conga-HPC/cTLH-HSP-HP-B

Standard heatspreader for high performance COM-HPC module conga-HPC/cTLH with integrated heatpipe, 13mm height. All standoffs are with 2.7mm bore hole.

050855

conga-HPC/cTLH-HSP-HP-T

Standard heatspreader solution for high performance COM-HPC module conga-HPC/cTLH with integrated heatpipe, 13mm height. All standoffs are with M2.5mm thread.

065600

conga-HPC/EVAL-Client

Evaluation Carrier Board for COM-HPC Client type Modules.

conga-HPC/cTLH

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